Micron Technology Inc. (NASDAQ:MU) said it will officially break ground on January 16, 2026, for its new semiconductor manufacturing complex in Onondaga County, New York, marking a $100 billion investment that the company describes as the largest private project ever undertaken in the state.
The site is expected to eventually accommodate up to four fabrication plants and is planned to become the largest semiconductor manufacturing campus in the United States. Micron said the facility will focus on producing advanced memory chips designed to support artificial intelligence applications.
The groundbreaking event will be attended by Micron’s Chairman, President and Chief Executive Officer Sanjay Mehrotra, alongside federal, state and local officials. A follow-on celebration is scheduled to take place at Syracuse University’s National Veterans Resource Center.
Commenting on the milestone, Mehrotra said: “Breaking ground at Micron’s New York megafab is a pivotal moment for Micron and the United States,” adding his thanks to government leaders for their backing in bringing the project to this stage.
Micron noted that it has completed all required environmental reviews and secured the necessary permits to begin construction. In its announcement, the company highlighted its position as the only manufacturer of memory semiconductors based in the United States.
The new facility is intended to help meet what Micron described as rising demand for AI-driven systems across the global economy. The company did not disclose a detailed construction timeline or target dates for the start of production.