Micron Technology (NASDAQ:MU) moved higher after executives signaled that volume shipments of its next-generation HBM4 memory have begun earlier than previously indicated.
Speaking at Wolfe Research’s Autos/Semis conference on Wednesday, Micron’s leadership team — including CFO Mark Murphy — addressed market speculation around potential technical issues with its HBM4 chips. Management said the company now expects meaningful HBM4 volume shipments in the current quarter, one quarter ahead of the timeline outlined during its December earnings call.
Executives added that business conditions have improved since December, with demand described as “significantly higher” than current supply capacity. That imbalance is expected to persist beyond 2026. The company also reported “good progress” on securing multi-year supply agreements with select customers and reaffirmed expectations for further margin expansion.
Micron provided updates on its capacity buildout plans, noting that construction has begun on new fabrication plants in New York and Singapore. The Singapore facility is slated to start NAND production in the second half of 2028, while the Idaho fab is expected to contribute output beginning in the second half of 2027.
Management expressed strong confidence in the performance, quality and reliability of HBM4, stating that capacity for calendar 2026 is already fully allocated and that production yields remain on track despite what the company described as “inaccurate reporting” surrounding the product.