Texas Instruments (NASDAQ:TXN) has unveiled three new semiconductor products designed to address power monitoring, high-voltage distribution and signal timing requirements in artificial intelligence data centres.
The products were introduced at the Open Compute Project (OCP) Global Summit in San Jose, California, as demand for AI computing infrastructure continues to increase the technical requirements of data centre power and networking systems.
The new devices include the ADC34DSO75 analogue-to-digital converter, the LMI800PS high-voltage hot-swap controller and the LMK6B oscillator.
Each component targets a different aspect of data centre infrastructure, with Texas Instruments focusing on improving power system visibility, simplifying electrical architectures and supporting high-speed data transmission.
The company said the products are intended to help operators manage increasingly complex AI workloads while maintaining reliable power delivery and network performance.
High-Speed Converter Targets Real-Time Power Monitoring
The ADC34DSO75 is a 3 gigasamples-per-second analogue-to-digital converter designed to provide detailed monitoring of electrical power systems.
Texas Instruments describes the product as the highest-performance device in its category, with the ability to continuously monitor power rails remotely and detect electrical events at nanosecond resolution.
According to the company, the monitoring capability operates thousands of times faster than existing solutions, potentially allowing operators to identify short-duration power fluctuations that conventional monitoring equipment may miss.
The converter also incorporates on-chip digital signal processing, enabling it to analyse electrical signals and identify transient power faults.
This functionality is intended to reduce the need for technicians to use on-site diagnostic equipment, including oscilloscopes, when investigating certain power-related issues.
The device targets AI data centres where rapid changes in computing workloads can place additional demands on electrical infrastructure.
By providing more detailed information about power behaviour, the chip is designed to support fault detection and system monitoring in large-scale computing environments.
New Controller Supports 800V Data Centre Power Distribution
Texas Instruments also introduced the LMI800PS, which it describes as the industry’s first isolated hot-swap controller designed for 800V applications.
The device is intended to support high-voltage power distribution architectures increasingly being considered for large AI data centres.
According to the company, the controller combines functions that previously required five separate integrated circuits into a single package.
This integration reduces the required circuit board area by more than 60%, potentially simplifying system design and reducing the space occupied by power management components.
The LMI800PS supports both ±400V and 800V power distribution configurations, providing flexibility for different electrical system architectures.
It also meets 5kVrms reinforced isolation requirements, an important consideration for equipment operating at elevated voltages.
The controller is designed to enable safer connection and disconnection of electrical loads while supporting the management of high-voltage power systems.
The introduction reflects the growing importance of efficient power distribution as AI infrastructure operators deploy increasingly power-intensive computing equipment.
Oscillator Designed for High-Speed AI Networking
The third product, the LMK6B, is a bulk acoustic wave-based oscillator designed to provide precise timing signals for high-speed networking equipment.
Texas Instruments specified jitter performance of 9.6 femtoseconds at 625MHz, targeting infrastructure supporting data transmission speeds approaching 3.2 terabits per second.
Low-jitter timing components are important for maintaining signal integrity as networking systems operate at higher frequencies and data rates.
The LMK6B is intended to support these requirements in data centre communications equipment, where reliable timing is necessary for high-bandwidth connections.
“As AI workloads drive massive scale, the need for real-time visibility and architectural stability has never been greater,” said Karthik Vasanth, vice president and general manager of Texas Instruments’ Data, Converters and Clocks business unit.
The three products were demonstrated at the OCP Global Summit, where Texas Instruments exhibited at booth E45.
The company also announced that David Reusch, a power electronics engineer, would deliver a presentation on 800V data centre design at the event on 15 October.
The announcements expand Texas Instruments’ portfolio of components aimed at AI data centre infrastructure, with a particular emphasis on electrical reliability, power system integration and high-speed connectivity.
As operators develop larger computing installations, the company is positioning its analogue and power management technologies to address the supporting infrastructure requirements of advanced AI systems.