Teradyne, Inc. (NASDAQ:TER) said it will showcase its latest semiconductor test technologies at SEMICON China 2026, which will be held March 25–27 at the Shanghai New International Expo Centre in Shanghai.
The automated test equipment and robotics company will demonstrate several of its newest testing platforms at booth 2371 in Hall N2, where visitors will be able to meet with company engineers and explore technologies designed to support the next generation of AI and high-performance semiconductor devices.
Teradyne will also sponsor the SEMICON China Design Innovation Forum session focused on AI Intelligent Applications and Automotive ICs, reflecting growing industry demand for testing solutions tailored to AI infrastructure and advanced automotive chips.
At the exhibition, Teradyne plans to feature four major test systems aimed at addressing the increasing complexity of modern semiconductors used in AI data centers, networking equipment and advanced automotive electronics.
The UltraFLEXplus platform is designed to test AI accelerators, xPUs, data center networking chips and ADAS semiconductors. The scalable system combines advanced digital capabilities with high-power delivery to meet the performance and reliability requirements of next-generation devices while helping manufacturers accelerate time to market through automation and streamlined workflows.
The ETS-800 platform is built to deliver stable voltage and highly accurate measurements for ultra-low resistance devices. The system is designed to support reliable resistance measurements while enabling production scalability from low-volume testing to large-scale manufacturing.
Teradyne will also present the Titan HP, a system-level testing solution developed for AI and cloud computing hardware. The platform features active thermal control and multi-branch cooling technology to prevent overheating while optimizing testing throughput. The system currently supports up to two kilowatts of power, with a roadmap to expand to four kilowatts to meet future device requirements.
Another system on display will be Magnum EPIC, a high-performance test solution designed for next-generation DRAM devices. The platform uses a near-device-under-test architecture to improve signal integrity at high data speeds and features more than 18,000 high-speed digital channels. It supports testing speeds of up to 12.12 Gbps and high parallel capacity for large-scale DRAM production.
As part of the event, Teradyne will also participate in a featured session at the Design Innovation Forum. On Thursday at 16:40, company representatives will present DevOpsForTest, discussing approaches to improving semiconductor testing workflows.
The 2026 conference also marks a milestone for Teradyne as the company celebrates 25 years of operations in China. Since opening its first office in the country in 2001, the company said it has worked closely with local semiconductor manufacturers and electronics companies while expanding engineering and support capabilities in the region.
More about Teradyne
Teradyne (NASDAQ:TER) develops automated test equipment used to validate semiconductor and electronic devices, helping manufacturers ensure product performance and quality. The company also operates an advanced robotics division focused on collaborative and mobile robots used in manufacturing and logistics environments.