Tower Semiconductor Ltd. (NASDAQ:TSEM) has partnered with Axiro Semiconductor to introduce new radar beamforming integrated circuits produced at Tower’s U.S. manufacturing sites using Silicon Germanium (SiGe) technology.
The chips are tailored for defense radar systems and satellite communications, with Ku- and X-band beamforming ICs now moving into volume production, according to a joint announcement. Axiro designed the components specifically for defense use cases that require domestically sourced technology.
“Tower has an established presence as a leading vendor to the U.S. aerospace and defense industry,” said Mike Scott, Vice President and General Manager of the Aerospace & Defense Business Unit at Tower Semiconductor. “This A&D experience, along with our market-leading SiGe technology capabilities, sets the foundational performance and scalability essential for modern defense systems.”
Naveen Yanduru, CEO of Axiro Semiconductor, said the company chose Tower for its expertise in Silicon Germanium. “As a U.S.-based company, we design and deliver our domestically engineered solutions directly to American defense prime contractors,” he said.
The semiconductors are manufactured in Tower’s U.S. facilities and engineered by Axiro for radar platforms requiring high gain, strong linearity, robust output power and rapid switching performance.
The collaboration is aimed at reinforcing domestic defense supply chains by ensuring access to U.S.-produced semiconductor components.
Tower Semiconductor operates fabrication plants in Israel, the United States and Japan, providing analog semiconductor manufacturing services across industries including aerospace and defense.