Disco Corp. (USOTC:DSCSY) reported preliminary second-quarter figures for its fiscal year ending March 2027, with parent-company revenue reaching ¥118.5 billion.
Revenue increased 24.7% from the previous quarter and 38.9% from the same period a year earlier.
Shipments totalled ¥123.9 billion, representing a 6.4% increase quarter over quarter and a 60.0% rise year over year.
The figures come amid demand associated with artificial intelligence applications and advanced semiconductor manufacturing.
Consolidated Revenue Estimated at ¥143.9 Billion
Based on regression analysis included in the supplied material, Disco’s preliminary parent-company figures imply consolidated revenue of approximately ¥143.9 billion and consolidated shipments of ¥149.1 billion.
The implied shipment figure is 5.8% above company guidance and 2.7% higher than analyst consensus estimates.
Revenue is estimated to have exceeded company guidance by 12% and analyst consensus expectations by 3.4%.
The consolidated figures are estimates derived from the preliminary parent-company data rather than reported consolidated results.
Foreign Exchange Impact Remains Limited
Foreign exchange movements had a limited impact on the preliminary results, with the company recording an exchange rate of approximately ¥159 to the U.S. dollar, broadly in line with expectations.
Disco said the ratio between consolidated and parent-company results is expected to remain around its typical level of 1.2 times.
The company also indicated that shipments could be towards the higher end of expectations because of a larger-than-anticipated contribution from consumables.
Disco Addresses HBM Manufacturing Changes
Disco also addressed potential changes in specifications for high-bandwidth memory, including the use of eight-layer, or 8-hi, stacks.
The company said it does not view 8-hi stacks negatively, noting that a change in specifications would not alter the overall volume or number of wafers.
Disco also said that using fewer layers could result in a larger number of HBM packages, potentially increasing the use of mould singulation equipment. This represents the company’s assessment of the potential impact of changes in HBM manufacturing specifications.